Electro-mechanical studies of micro-tube insertion into Al-Cu pads for 10 mu m pitch interconnection technology and 3D applications

Abstract : Various interconnection technologies such as reflow soldering, thermo-compression, Direct Bond Interconnect (DBI), Solid Liquid Inter Diffusion (SLID) and insertion are under intense investigation in order to accommodate the latest revision of the International Technology Roadmap for Semiconductors (ITRS). The room-temperature insertion technology has been proposed and developed using micro-tubes as inserts to address most of the industrial bonding issues. In the present work, we experimentally study the electrical and mechanical behavior of a single golden micro-tube and its insertion into Al-0.5Cu pads. A modified nano indenter coupled with an electrical measurement device were used in order to determine the insertion mechanisms and mechanical behavior during large plastic deformation of the gold and Al-Cu. Furthermore, finite element (FE) simulations are added to complete the analysis. The numerical load and displacement results are compared with experiments and complemented with a geometrical cross section examination.
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Microelectronic Engineering, Elsevier, 2013, 107, pp.84-90. 〈10.1016/j.mee.2012.10.021〉
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https://hal.univ-lorraine.fr/hal-01501447
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Soumis le : mardi 4 avril 2017 - 11:51:56
Dernière modification le : mercredi 14 février 2018 - 14:06:11

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B. Goubault de Brugiere, F. Marion, M. Fendler, V. Mandrillon, Alain Hazotte, et al.. Electro-mechanical studies of micro-tube insertion into Al-Cu pads for 10 mu m pitch interconnection technology and 3D applications. Microelectronic Engineering, Elsevier, 2013, 107, pp.84-90. 〈10.1016/j.mee.2012.10.021〉. 〈hal-01501447〉

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