Electric Vehicles. Prospects for battery, fuel cell and hybrid-powered vehicles, Rapport Financial Times Automotive, 1999. ,
Estimation de modèles de durée de vie fortement censurées, Editions Eyrolles, 1998. ,
The Insulated Gate Transistor: A new three-terminal MOS controlled bipolar power device, IEEE Transactions on Electron Deviees, vol.31, pp.6821-828, 1984. ,
Nouvelle alimentation de four à arc, Thèse de doctorat, 2002. ,
The exponential law of endurance tests, Proceedings ofATSM, vol.11, pp.625-630, 1910. ,
La fatigue des matériaux et des structures" édition Hermès, 1997. ,
Le matériel roulant de Météor Revue générale des chemins defer, pp.69-81, 1996. ,
Advanced IGBT modules for railway traction applications: Reliability testing, European Symposium on the Reliability of Electron Deviees, 1998. ,
Reliability Engineering Theory and Practice" EditionLes automotrices régionales TER-2N" Revue générale des chemins defer, nov, pp.11-26, 1997. ,
Packaging complements silicon In automotive ,
IGBT or IGCT: Consideration for very high power applications" Forum Européen des semiconducteurs de puissance, 1997. ,
Power Electronics for very high power applications" IEEIPEVD,09, 1998. ,
Composants de puissance en carbure de silicium" rapport GDR 11, p.5, 2000. ,
Sorne Reliability Aspects of IGBT Modules for High- Power Applications, Series in Microelectronics, vol.III, 2001. ,
A study of the effect of cyclic thermal stresses on a ducti le metal, ASME, pp.931-950, 1954. ,
Fiabilité des modules de fortes puissances Influence de la fatigue thermique due aux cycles de traction. Essais accélérés de cyclage thermique en pu issance, p.pp, 1996. ,
Les modules IGBT de forte puissance. Leur essor dans les applications de traction ferroviaire, 1998. ,
Reliability improvement of the soldering thermal fatigue with AISiC technology on traction high power [GBT modules, European Conference on Power Electronics and Applications (EPE), 1999. ,
On the effect of the power cycling stress on IGBT modules, European Symposium on the Reliability of Electron Deviees, Failures Physics and Analysis (ESREF), 1999. ,
Les modules IGBT" Electronique nO}03, 2000. ,
-the same electric drive train, 16 th Electric Vehicle Symposium (EVS), oct, 1999. ,
The 10kV [GCT- A new device for medium voltage drives, JAS, 2000. ,
High Temperature Automotive Electronics: an overview, 1998. ,
IGCT Technology-A quantum leap for high-power converter, IEEEIPES, 1998. ,
Power temperature cycle accelerated testing" Quality and Reliability engineering international, pp.41-48, 1995. ,
Fast power cycling test for IGBT modules in traction application, 1997. ,
Intregrated power module In IGBT technology for modular power traction converters, European Conference on Power Electronics and Applications (EPE), 1997. ,
Etude du comportement thermomécanique et de la fiabilité des assemblages de composants montés en surfac, utilisés en environnement automobile sévère, Thèse de doctorat, 1993. ,
3.3KY and 2.5 KY Press pack switching performance and mechanical reliability ,
On-state and short circuit behaviour of high voltage trench gate IGBTs in comparison with planar IGBTs, International symposium on Power Semiconductor Deviees & ICs (ISPSD), pp.824-829, 1995. ,
Electronic component reliability, IEEE Aerospace and Electronic Systems Magazine, vol.14, issue.5, 1995. ,
DOI : 10.1109/MAES.1999.765777
Electric and hybrid vehicles, European Conference on Power Electronics and Applications (EPE), pp.30-54, 1995. ,
The future of Electronics in Automobiles, International Symposium on power Semiconductor Deviees & ICs (ISPSD), pp.15-19, 2001. ,
The short-circuit behaviour of IGBTs based on different, European Conference on Power Electronics and Applications (EPE), pp.157-161, 1995. ,
Reliability testing of high-power multi-chip IGBT modules, European Symposium on the Reliability of Electron Deviees, Failures Physics and Analysis, 2000. ,
DOI : 10.1016/S0026-2714(00)00185-2
Properties of solders and their fatigue in power modules, European Symposium on the Reliability of Electron Deviees, Failures Physics and Analysis, 2002. ,
DOI : 10.1016/S0026-2714(02)00203-2
6.5kY Press Pack IGBT, Eupec, issue.1100 ,
URL : https://hal.archives-ouvertes.fr/in2p3-00008779
Impact des matériaux sur les systèmes de puissance du futur" rapport GDR n02084, 2000. ,
Behaviour of materials under conditions of thermal stress" Heat transfert symposium, pp.9-75, 1952. ,
Fatigue: A complex subject???Some simple approximations, Experimental Mechanics, vol.7, issue.1, pp.193-226, 1965. ,
DOI : 10.1115/1.3662256
Econopack+ a new IGBT module for optimized inverter solutions, 2000. ,
Etude de circuits d'aide à la commutation de thyristors GTO montés en série pour des applications à la traction ferroviaire, Thèse de doctorat, 1986. ,
De nouveaux composants arrivent, l'intégration de puissance continue son évolution: Quelles conséquences 7, 1998. ,
AlSiC composites as a base material for high power, PCIM Europe, vol.06, pp.70-73, 2000. ,
Power semiconductors empirical diagrams expressing life as a function of temperature excursion, IEEE Transactions on Magne tics, issue.1, pp.1-29, 1993. ,
IGCT devicesapplications and future opportunities, IEEE/PES, 2000. ,
DOI : 10.1109/pess.2000.867555
Fuel Cell System for Transportation Applications: Modelling and Experimental Validation ,
Méthodologie basée sur des simulations par éléments finis pour évaluer la relation entre les tests de vieillissements accélérés et la réalité de fonctionnement de modules de puissances à IGBT, 1992. ,
European development of Hybrid Technology approaching efficient Zero Emission Mobility (HYZEM)-Driving patterns analysis and driving cycles" rapport INRETS, p.9709, 1997. ,
Driving cycles derived from real-world in-vehicle measurements for passenger cars and light duty vehicles: principles, database and main results -Particular case of the ARTEMIS driving cycles" rapport INRETS, pp.2-2, 2001. ,
Estimation de la durée de vie de modules IGBT pour véhicules hybrides à partir de la mesure directe de température de puce, JCGE'Ol, Journée Jeunes Chercheurs en Génie Electrique, 2001. ,
Mesure directe de température par fibre optique sur puce IGBT pour véhicule hybride-Méthodologie, 2001. ,
Methodology for Reliability Evaluation of a HEV Inverter Module by Silicon Temperature Direct Measurement, l8' h International Electric Vehicle Symposium (EVS 18) Berl in, novem bre, 2001. ,
Lifetime prediction of IGBT module for traction applications, Proceedings of 38 IEEE International Reliability Physics Symposium, pp.210-216, 2000. ,
A novel thermomechanics-based lifetime prediction model for cycle fatigue failure mechanisms in power semiconductors, European Symposium on the Reliability of Electron Deviees, Failures Physics and Analysis, 2002. ,
Power module lifetime estimation from chip temperature direct measurement in an automotive traction inverter, Microelectronics Reliability, vol.041, pp.1695-1700, 2001. ,
Electric Kangoo Electric Vehicle Symposium, EVS, vol.17, 1999. ,
La fatigue thermique" Motorola semiconducteur, 1987. ,
Tout savoir sur la résistance thermique et les causes de défaillance dans les semiconducteurs de puissance, Note Motorola semiconducteur, pp.1986-1992 ,
Dispositifs de l'Electronique de Puissance, Hermes, vol.I, 1992. ,
Température de surface -Mesure par contact ,
Boundary Element methods in Heat Transfer" Co-published by Computational Mechanics Publications and, 1992. ,
A timedomain method for the analysis of thermal impedance response preserving the convolution form, IEEE transactions on packaging and technology, pp.1-22, 1999. ,
Experimental validation of a thermal modelling method dedicated to multichip power modules under working conditions" 8 th International workshop on thermal investigations on IC's microstructures (THERMINIC) -Madrid, 2002. ,
Experimental validation of a thermal modelling method dedicated to multichip power modules in operating conditions, Microelectronic Journal, Editions Elsevier Applied Science, 2003. ,
A new Procedure for the Calculation of the Temperature Development in Electronic System, European Conference on Power Electronics and Applications (EPE), 1999. ,
Thermal Analysis of High Power IGBT Modules, International Symposium on Power Semiconductors Deviees (ISPSD), 2000. ,
Power Analysis of Power Cycling Effects on Hugh Power IGBT Modules by the Boundary Element Method" SEMiconductor THERmal Management (SEMI-THERM XVIII), 2001. ,
Real-Time Computation of Thermal Constraints in Multichip Power Electronics Deviees, IEEE Transactions on Components ,
Echanges thermiques: la conduction" Technologie & Electronique, édition Alisson, VoI.4-no40, sept, p.97 ,
The finite element method in heat transfer analysis, 1996. ,
Paramètres physiques des matériaux" Technologie & Electroniques, éditions Alisson, HS n04, p.94 ,
Transient thermal analysis of solid state power devices -making a dreaded process easy, 1975. ,
Numerical Recipes in Fortran: The art of scientific computing, Cambridge, 1992. ,
Implement and Validation of a Thermal Model for Analysis, Design and Characterisation of Multichip Power Electronic Deviees, IEEE Transactions on lndustry Applications, vol.35, issue.3, 1999. ,
Hybrid light duty vehicles evaluation program, 19/ h International Electric Vehicle Symposium (EVS 19), 2002. ,
Static and dynamic thermal characteristics of [GBT power modules, 1th International symposium on power semiconductor devices & IC 's (ISPSD), pp.37-40, 1999. ,
Thermal component model for electrothermal analysis of IGBT module systems, IEEE transactions on advanced packaging, pp.1-24, 2001. ,