Lead-free Solders in Microelectronics, Materials Science and Engineering: R: Reports, vol.27, issue.5-6, pp.5-695141, 2000. ,
DOI : 10.1016/S0927-796X(00)00010-3
Small particle melting of pure metals, Thin Solid Films, vol.144, issue.2, p.297308, 1986. ,
DOI : 10.1016/0040-6090(86)90422-0
Microstructural evolution in leadfree solder alloys: Part I. Cast SnAgCu eutectic, Journal of materials research, vol.19, issue.05, p.14171424, 2004. ,
Microstructural evolution in lead-free solder alloys: Part II. Directionally solidified Sn-Ag-Cu, Sn-Cu and Sn-Ag, Journal of Materials Research, vol.280, issue.05, p.14251431, 2004. ,
DOI : 10.1111/j.1151-2916.2001.tb01126.x
Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability, Journal of Electronic Materials, vol.30, issue.9, p.10501059, 2001. ,
DOI : 10.1007/BF03222379
Alloy Phase Diagrams, ASM Handbook, vol.3, p.501, 1992. ,
Thermomechanical fatigue behavior of selected lead-free solders, 2001. ,
Influences of pileup on the measurement of mechanical properties by load and depth sensing indentation techniques, Journal of Materials Research, vol.356, issue.04, p.10491058, 1998. ,
DOI : 10.1016/0022-5096(63)90035-8
Size effect on the melting temperature of gold particles, Physical Review A, vol.243, issue.6, p.22872298, 1976. ,
DOI : 10.1098/rsta.1951.0006
Reduction of lead free solder aging effects using doped SAC alloys, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), p.14931511, 2010. ,
DOI : 10.1109/ECTC.2010.5490796
Materials Science and Engineering: An Introduction, 1985. ,
Lead-Free solder ,
Study of Adding Sb into Lead-free Sn-Ag Solder Joints on Metallurgical and Mechanical Properties, 2003. ,
Effect of Ag and Cu concentrations on the creep behavior of Snbased solders, Journal of Electronic Materials, vol.37, issue.3, p.347354, 2008. ,
Properties of lead-free solder SnAgCu containing minute amounts of rare earth, Journal of Electronic Materials, vol.114, issue.4, p.235243, 2003. ,
DOI : 10.1016/S0921-5093(00)00661-4
Study on the microstructure of a novel lead-free solder alloy SnAgCu-RE and its soldered joints, Journal of Electronic Materials, vol.29, issue.10, pp.31-11221128, 2002. ,
DOI : 10.1016/S0921-5093(00)00661-4
Constitutive relations on creep for SnAgCuRE lead-free solder joints, Journal of Electronic Materials, vol.194, issue.9, p.964971, 2004. ,
DOI : 10.1007/s11664-004-0023-z
Scaling, dimensional analysis, and indentation measurements, Materials Science and Engineering: R: Reports, vol.44, issue.4-5, pp.4-5, 2004. ,
DOI : 10.1016/j.mser.2004.05.001
Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging, Journal of Electronic Materials, vol.23, issue.11, pp.28-12091215, 1999. ,
DOI : 10.1007/BF02675563
Depth-sensing instrumented indentation with dual sharp indenters, Acta Materialia, vol.51, issue.13, pp.51-37133729, 2003. ,
DOI : 10.1016/S1359-6454(03)00186-1
Nanoindentation measurements on CuSn and AgSn intermetallics formed in Pb-free solder joints, Journal of Materials Research, vol.18, p.22512261, 2003. ,
Acceleration factors and thermal cycling test efficiency for lead-free Sn-Ag- Cu assemblies, Proceedings, SMTA international conference, pp.902-917, 2005. ,
Computational modeling of the forward and reverse problems in instrumented sharp indentation, Acta Materialia, vol.49, issue.19, p.38993918, 2001. ,
DOI : 10.1016/S1359-6454(01)00295-6
Deformation behavior of (Cu, Ag)???Sn intermetallics by nanoindentation, Acta Materialia, vol.52, issue.14, pp.52-42914303, 2004. ,
DOI : 10.1016/j.actamat.2004.05.046
Mechanical Metallurgy, 1986. ,
DOI : 10.5962/bhl.title.35895
Novel rare-earth-containing lead-free solders with enhanced ductility, JOM, vol.10, issue.3, pp.58-5762, 2006. ,
DOI : 10.1179/095066095790151115
Oxidation Behavior of solders, Surface Science, vol.104, p.559568, 1981. ,
Impression creep characterization of rapidly cooled Sn???3.5Ag solders, Materials Science and Engineering: A, vol.379, issue.1-2, p.401410, 2004. ,
DOI : 10.1016/j.msea.2004.03.023
A constitutive model for creep of lead-free solders undergoing strain-enhanced microstructural coarsening: A first report, Journal of Electronic Materials, vol.65, issue.4, pp.201-207, 2003. ,
DOI : 10.1007/s11664-003-0210-3
Indentation size effect in polycrystalline F.C.C. metals, Acta Materialia, vol.50, issue.14, p.5036413650, 2002. ,
DOI : 10.1016/S1359-6454(02)00175-1
Physical and mechanical properties of intermetallic compounds commonly found in solder joints. The Metal Science of Joining, p.165174, 1991. ,
Lead-free Solders with Rare Earth Additions. Lead-free solders Research summary, pp.39-44, 2009. ,
Mechanical properties versus temperature relation of individual phases in Sn-3.0 Ag-0.5 Cu lead-free solder alloy, Microelectronics Reliability, vol.49, issue.3, p.296302, 2009. ,
Mechanical properties evolution of Sn-3.5 Ag based lead-free solders by nanoindentation, Materials Letters, issue.19, p.6023152318, 2006. ,
The Constitution of the System Ag-Cu-Sn, Journal of Metallurgy, vol.50, p.597605, 1959. ,
Issues regarding microstructural coarsening due to aging of eutectic tinsilver solder, TMS Annual Meeting, Design Reliability of Solders and Solder Interconnections, p.97103, 1997. ,
Melting in Semiconductor Nanocrystals, Science, vol.256, issue.5062, p.14251427, 1992. ,
DOI : 10.1126/science.256.5062.1425
A modified constitutive model for creep of Sn3.5Ag0.7Cu solder joints, Journal of Physics D: Applied Physics, issue.12, p.4218, 2009. ,
Microstructure Evolution of SnAgCuEr Lead-free Solders Under High Temperature Aging, Journal of Electronic Materials, vol.27, issue.1, p.28, 2008. ,
DOI : 10.1007/s11664-007-0263-9
Ag3Sn plate formation in the solidification of near ternary eutectic SnAgCu alloys, Journal of Materials Research, vol.17, issue.11, p.27752778, 2002. ,
Simplifications and improvements in unified constitutive equations for creep and plasticity???I. Equations development, Acta Metallurgica et Materialia, vol.38, issue.11, pp.2101-2115, 1990. ,
DOI : 10.1016/0956-7151(90)90077-T
Deformation and Fracture Mechanics of Engineering Materials, Journal of Engineering Materials and Technology, vol.99, issue.1, 1996. ,
DOI : 10.1115/1.3443416
Creep behavior of eutectic Sn???Ag lead-free solder alloy, Journal of Materials Research, vol.272, issue.11, pp.17-28972903, 2002. ,
DOI : 10.1007/s11664-000-0150-0
VMD: Visual molecular dynamics, Journal of Molecular Graphics, vol.14, issue.1, pp.3338-2728, 1996. ,
DOI : 10.1016/0263-7855(96)00018-5
Fracture of Sn-3.5%Ag solder alloy under creep, Journal of Electronic Materials, vol.32, issue.12, p.13561361, 2000. ,
DOI : 10.5006/0010-9312-32.5.201
Microstructure changes in Sn-3.5 Ag solder alloy during creep, Journal of electronic materials, vol.27, issue.12, p.13671371, 1998. ,
Creep phenomena in lead-free solders, Journal of Electronic Materials, vol.222, issue.2, p.244250, 2000. ,
DOI : 10.1007/978-94-011-9691-8_2
Rare-earth-enabled universal solders for microelectromechanical systems and optical packaging, Journal of Electronic Materials, vol.83, issue.12, p.13661370, 2003. ,
DOI : 10.1007/BF03220718
Low cycle fatigue test for solders using non-contact digital image measurement system, International Journal of Fatigue, vol.24, issue.1, p.5767, 2002. ,
DOI : 10.1016/S0142-1123(01)00052-4
Formation of AgSn plates in Sn-Ag-Cu alloys and optimization of their alloy composition, 53rd Electronic Components and Technology Conference, 2003. Proceedings., p.6470, 2003. ,
DOI : 10.1109/ECTC.2003.1216258
Creep deformation behavior of Sn???3.5Ag solder/Cu couple at small length scales, Acta Materialia, vol.52, issue.15, pp.4527-4535, 2004. ,
DOI : 10.1016/j.actamat.2004.06.010
Effects of cooling speed on microstructure and tensile properties of Sn???Ag???Cu alloys, Materials Science and Engineering: A, vol.333, issue.1-2, pp.106-114, 2002. ,
DOI : 10.1016/S0921-5093(01)01828-7
Mechanical properties of near-eutectic Sn-Ag-Cu alloy over a wide range of temperatures and strain rates, Journal of Electronic Materials, vol.123, issue.12, p.15811588, 2004. ,
DOI : 10.1007/s11664-004-0101-2
modeling thermomechanical fatigue behavior of sn-ag solder joints, journal of electronic materials, Journal of Electronic Materials, issue.11, pp.31-11521159, 2002. ,
Determination of the eutectic structure in the Ag-Cu-Sn system, Journal of Electronic Materials, vol.14, issue.2, pp.31-161167, 2002. ,
DOI : 10.1179/026708397790242851
The kinetics of precipitation from supersaturated solid solutions, Journal of Physics and Chemistry of Solids, vol.19, issue.1-2, p.3550 ,
DOI : 10.1016/0022-3697(61)90054-3
Tin-silver-copper eutectic temperature and composition, Metallurgical and Materials Transactions A, vol.63, issue.4, p.11551162, 2000. ,
DOI : 10.1007/s11661-000-0111-5
Nanoindentation on SnAgCu lead-free solder joints and analysis, Journal of Electronic Materials, vol.30, issue.6, p.21072115, 2006. ,
DOI : 10.1016/S1044-5803(02)00192-4
Effect of La on the Cu???Sn intermetallic compound (IMC) growth and solder joint reliability, Journal of Alloys and Compounds, vol.334, issue.1-2, pp.224-227, 2002. ,
DOI : 10.1016/S0925-8388(01)01747-9
Martin a. rist, w. j. plumbridge, s. cooper Creep-constitutive behavior of sn- 3.8ag-0.7cu solder using an internal stress approach, Journal of Electronic Materials, vol.35, issue.5, 2006. ,
URL : https://hal.archives-ouvertes.fr/hal-00882435
Lead-free universal solders for optical and electronic devices, Journal of Electronic Materials, vol.74, issue.11, pp.31-11601165, 2002. ,
DOI : 10.1007/BF03220718
A constitutive model of cyclic viscoplasticity considering changes in subsequent viscoplastic deformation due to the evolution of dislocation structures, International Journal of Plasticity, vol.23, issue.5, pp.915-930, 2007. ,
DOI : 10.1016/j.ijplas.2006.10.003
Nanoindentation of nanocrystalline ZnO, Journal of Materials Research, vol.3, issue.04, p.973979, 1992. ,
DOI : 10.1007/BF00638018
A micro-indentation study of superplasticity in Pb, Sn, and Sn-38 wt% Pb, Acta Metallurgica, vol.36, issue.8, p.21832192, 1988. ,
DOI : 10.1016/0001-6160(88)90319-7
Creep of tin, Sb-solution-strengthened tin, and SbSn-precipitate-strengthened tin, Metallurgical and Materials Transactions A, vol.29, issue.5, pp.1531-1539, 2002. ,
DOI : 10.1007/BF02643744
The creep properties of precipitation-strengthened tin-based alloys, JOM, vol.19, issue.6, p.3335, 2000. ,
DOI : 10.1179/095066074790137088
Athermal and thermally activated plastic flow in low melting temperature solders at small stresses, Scripta Materialia, vol.39, issue.2, p.189195, 1998. ,
DOI : 10.1016/S1359-6462(98)00149-3
A viable tin-lead solder substitute: Sn-Ag-Cu, Journal of Electronic Materials, vol.17, issue.7, p.595601, 1994. ,
DOI : 10.1016/0921-5093(91)90870-S
Effects of Lanthanum Doping on the Microstructure and Mechanical Behavior of a Sn-Ag Alloy The Georgia Institute of Technology, 2007. ,
Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys, Journal of Electronic Materials, vol.5, issue.10, pp.29-11221136, 2000. ,
DOI : 10.1007/978-1-4684-1440-0_4
Physical Characteristics of Stable Silver Nanoparticles Formed Using a New Thermal-Decomposition Method, phys. stat. sol, p.6776, 0191. ,
Using carbon nanotubes to enhance creep performance of lead free solder, Materials Science and Technology, vol.24, issue.4, pp.443-448, 2008. ,
DOI : 10.1007/s11664-000-0150-0
Effects of cerium content on wettability, microstructure and mechanical properties of Sn???Ag???Ce solder alloys, Journal of Alloys and Compounds, vol.499, issue.2, pp.154-159, 2010. ,
DOI : 10.1016/j.jallcom.2010.03.179
High temperature deformation of oxide dispersion strengthened al and AlMg solid solutions, Acta Metallurgica, vol.30, issue.7, p.13351347, 1982. ,
An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments, Journal of Materials Research, vol.XI, issue.06, p.15641583, 1992. ,
DOI : 10.1557/S0883769400054440
URL : https://hal.archives-ouvertes.fr/hal-01518596
an evaluation of the densification characteristics of nanocrystalline materials, Nanostructured Materials, vol.2, p.181187, 1993. ,
Effect of Rare Earth Elements on Lead-Free Solder Microstructure Evolution, 2007 Proceedings 57th Electronic Components and Technology Conference, 2007. ,
DOI : 10.1109/ECTC.2007.373798
Effect of Lanthanum Doping on the Microstructure of Tin-Silver Solder Alloys, Journal of Electronic Materials, vol.19, issue.5, p.331338, 2007. ,
DOI : 10.1007/s11664-007-0335-x
Bonding nature of rare-earth-containing lead-free solders, Applied Physics Letters, vol.50, issue.3, p.398, 2002. ,
DOI : 10.1063/1.123818
Micromechanical characterization of thermomechanically fatigued lead-free solder joints, Journal of Materials Science: Materials in Electronics, vol.13, issue.8, p.477484, 2002. ,
Creep-constitutive behavior of Sn-3.8 Ag-0.7 Cu solder using an internal stress approach, Journal of electronic materials, vol.35, issue.5, p.10501058, 2006. ,
Understanding the effect of dwell time on fatigue life of packages using thermal shock and intrinsic material behavior, 53rd Electronic Components and Technology Conference, 2003. Proceedings., p.898904, 2003. ,
DOI : 10.1109/ECTC.2003.1216398
grain growth in a superplastic zn-22% al alloy, acta metallurgica, p.97106, 1986. ,
Powercycling Reliability, Failure Analysis and Acceleration Factors of Pb-Free Solder Joints, Proceedings Electronic Components and Technology, 2005. ECTC '05., p.907915, 2005. ,
DOI : 10.1109/ECTC.2005.1441380
Effects of small amount addition of rare earth Er on microstructure and property of SnAgCu solder, Journal of Alloys and Compounds, vol.453, issue.1-2, pp.453-180184, 2008. ,
DOI : 10.1016/j.jallcom.2006.11.165
The relationship between microstructure and internal stress in a ?????-stengthened Superalloy, Materials Science and Engineering, vol.76, issue.0, pp.139-146, 1985. ,
DOI : 10.1016/0025-5416(85)90088-6
Effect of anisotropy of tin on thermomechanical behavior of solder joints, Journal of Materials Science: Materials in Electronics, vol.15, issue.4, p.235240, 2004. ,
DOI : 10.1023/B:JMSE.0000012461.69417.75
Lead-free soldering in electronics: science, technology and environmental impact, CRC, 2003. ,
DOI : 10.1201/9780203025772
Nanoindentation for measuring individual phase mechanical properties of lead free solder alloy, Journal of Materials Science: Materials in Electronics, vol.55, issue.6, p.514521, 2008. ,
DOI : 10.1016/j.msea.2004.07.061
Orientation imaging studies of Sn-based electronic solder joints, Journal of Materials Research, vol.15, issue.09, p.22942306, 2002. ,
DOI : 10.1557/S0883769400062448
Grain-boundary character and grain growth in bulk tin and bulk leadfree solder alloys, Journal of electronic materials, vol.33, issue.12, p.14121423, 2004. ,
Identification of Mechanical Properties of Intermetallic Compounds on Lead Free Solder, Electronic Components and Technology Conference, p.687, 2005. ,
ASM handbook: Metallography and microstructures, 2004. ,
Fatigue and Creep of Lead-free Solder Alloys: Fundamental Properties, 2006. ,
Improvement of wettability and tensile property in Sn???Ag???RE lead-free solder alloy, Materials Letters, vol.56, issue.6, p.10391042, 2002. ,
DOI : 10.1016/S0167-577X(02)00672-9
Microstructural dependence of constitutive properties of eutectic SnAg and SnAgCu solders, 53rd Electronic Components and Technology Conference, 2003. Proceedings., 2003. ,
DOI : 10.1109/ECTC.2003.1216277
Constitutive behaviour of lead-free solders vs. lead-containing soldersexperiments on bulk specimens and flip-chip joints, Electronic Components and Technology Conference Proceedings., 51st, p.890902, 2001. ,
Improvements of microstructure, wettability, tensile and creep strength of eutectic Sn???Ag alloy by doping with rare-earth elements, Journal of Materials Research, vol.3, issue.12, pp.17-31463154, 2002. ,
DOI : 10.1007/s11664-000-0150-0
Properties of lead-free solder alloys with rare earth element additions, Materials Science and Engineering: R: Reports, vol.44, issue.1, p.144, 2004. ,
DOI : 10.1016/j.mser.2004.01.001
Microstructure and mechanical properties of new lead-free Sn-Cu-RE solder alloys, Journal of Electronic Materials, vol.29, issue.9, pp.31-928932, 2002. ,
DOI : 10.1007/BF02651361
The properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elements, Journal of Electronic Materials, vol.18, issue.9, pp.31-921927, 2002. ,
DOI : 10.1007/s11664-002-0184-6
Creep behavior of eutectic Sn-Cu lead-free solder alloy, Journal of electronic materials, issue.5, pp.31-442448, 2002. ,
Rare-earth additions to lead-free electronic solders, Journal of Materials Science: Materials in Electronics, vol.18, issue.1, p.7791, 2007. ,
Effect of rare earth element additions on the microstructure and mechanical properties of tin-silver-bismuth solder, Journal of Electronic Materials, vol.11, issue.6, p.31564567, 2002. ,
DOI : 10.1007/s11664-002-0126-3
Aging and creep behavior of Sn3.9Ag0.6Cu solder alloy, Electronic Components and Technology Conference, pp.1325-1332, 2004. ,
Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach, Microelectronics Reliability, vol.44, issue.12, pp.1947-1955, 2004. ,
DOI : 10.1016/j.microrel.2004.04.023
Improvement on the microstructure stability, mechanical and wetting properties of Sn???Ag???Cu lead-free solder with the addition of rare earth elements, Journal of Alloys and Compounds, vol.376, issue.1-2, p.170175, 2004. ,
DOI : 10.1016/j.jallcom.2004.01.012
Alloy thermo-mechanism: theory and application, 1999. ,
The Effects of Aging on the Mechanical Behavior of Lead Free and Mixed Formulation Solder Alloys, 2010. ,
Investigation on properties of Sn???8Zn???3Bi lead-free solder by Nd addition, Journal of Alloys and Compounds, vol.480, issue.2, pp.903-907, 2009. ,
DOI : 10.1016/j.jallcom.2009.02.064
Study of Sn-Pb-RE solder, Materials Research Society Symposium Proceedings. p, p.137143, 1994. ,
Creep behavior of a ?????(NiAl) precipitation strengthened ferritic Fe???Cr???Ni???Al alloy, Acta Materialia, vol.46, issue.9, pp.2969-2976 ,
DOI : 10.1016/S1359-6454(98)00022-6
Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression, Journal of Electronic Materials, vol.27, issue.2, p.351355, 2009. ,
DOI : 10.1007/s11664-008-0591-4