J. O. Madden and L. Hunter, Three-dimensional microfabrication by localized electrochemical deposition, Journal of Microelectromechanical Systems, vol.5, issue.1, pp.24-32, 1996.
DOI : 10.1109/84.485212

W. Menz, W. Bacher, M. Harmening, and A. , Michel, «The LIGA Technique -a Novel Concept for Microstructures and the Combination with Si-technologies by Injection Molding, pp.69-73, 1991.

Y. Gardan, CAO, design et prototypage, p.10, 1995.

J. P. Perrin, D. Bur, S. Corbel, . Ph, A. Desprez et al., Application de la Stéréolithographie en Architecture, yd European Conference on Rapid Prototyping, Remark S.A. Ed, p.p, 1994.

S. Lachambre, Rapport de stage, Centre de Recherche en, Architecture et Ingénierie (CRAI), issue.06, 1993.

S. Corbel, A. L. Allanic, P. Schaeffer, and L. André, Computer-aided manufacture of three-dimensional objects by laser space-resolved photopolymerization, Journal of Intelligent & Robotic Systems, vol.8, issue.4, pp.301-312, 1994.
DOI : 10.1007/BF01276503

R. L. Cohen and K. W. West, Generative and Stabilizing Processes in Tin-Palladium Sols and Palladium Sol Sensitizers, Journal of The Electrochemical Society, vol.120, issue.4, pp.502-508, 1973.
DOI : 10.1149/1.2403486

]. T. Osaka, H. Takematsu, and K. Nihei, A Study on Activation and Acceleration by Mixed PdCl[sub 2]???SnCl[sub 2] Catalysts for Electroless Metal Deposition, Journal of The Electrochemical Society, vol.127, issue.5, pp.1021-1029, 1980.
DOI : 10.1149/1.2129810

J. Horkans, J. Kim, C. Mcgrath, and L. T. Romankiw, A TEM Study of the Effect of Accelerators on Pd-Sn Colloidal Catalysts and on the Initiation of Electroless Cu Deposition on Epoxy, Journal of The Electrochemical Society, vol.134, issue.2, pp.300-304, 1987.
DOI : 10.1149/1.2100450

]. J. Van-den-meerakker, On the mechanism of electroless plating. II. One mechanism for different reductants, Journal of Applied Electrochemistry, vol.108, issue.3, pp.395-400, 1981.
DOI : 10.1007/BF00613960

K. G. Mishra and R. K. Paramguru, Kinetics and Mechanism of Electroless Deposition of Copper, Journal of The Electrochemical Society, vol.143, issue.2, pp.510-516, 1996.
DOI : 10.1149/1.1836473

]. B. Hwang and S. H. Lin, Reaction Mechanism of Electroless Deposition: Observations of Morphology Evolution during Nucleation and Growth Via Tapping Mode AFM, Journal of The Electrochemical Society, vol.142, issue.11, pp.3749-3754, 1995.
DOI : 10.1149/1.2048408

O. R. Feldmann and . Melroy, The Mechanism of Electroless Cu Deposition: Extraction of the Oxidative and Reductive Electrochemical Half-Cell Currents from a Complete Bath, Journal of The Electrochemical Society, vol.136, issue.3, pp.640-643, 1989.
DOI : 10.1149/1.2096702

G. Bidan, «Propriétés électriques des polymères et applications », Édition Groupe Francais d'étude et d'application des Polymères, pp.137-212, 1993.

S. Machida, S. Miyata, and . Techagumpuch, «Chemical Synthesis of Highly Electrically Conductive Polypyrrole », Synthtic Metals, pp.311-318, 1989.

F. A. Uribe, J. Valerio, and S. Gottesfeld, Application of Conductive Polymer Precoats for the Metallization of Insulators », Synthetic Metals, pp.55-57, 1993.

M. Saurin and S. P. , Study of the chemical polymerization of pyrrole onto printed circuit boards for electroplating applications, Journal of Applied Polymer Science, vol.56, issue.1, pp.41-50, 1995.
DOI : 10.1002/app.1995.070560106

S. Gottesfeld, F. Uribe, and S. P. Armes, «The Application of a polypyrrole Precoat for the Metallization of Printed Circuit Boards, J. Electrochem. Soc, vol.139, p.15, 1992.

Y. F. Nicolau, S. Davied, F. Genoud, and M. , Nechtschein, 1. P. Travers, «Polyaniline, Polypyrrole, Poly(3-Methylthiophène) and Polybithiophène Layer-by-Layer Deposit Thin Films », Synthetic Metals, pp.41-43, 1991.

Y. F. Nicolau and S. , Davied, « Layer-by-Layer Chemical Deposition of Conducting Polymer Thin Films, Method and Procedure », Organic coating, Proceedings of the 53rd InternationalMeeting of Physical Chemistry, 1995.

L. B. Valdes, Resistivity Measurements on Germanium for Transistors, Proceedings of the 1.R.E, pp.420-427, 1954.
DOI : 10.1109/JRPROC.1954.274680

R. A. Moody and T. G. Tetreault, 1. K. Hirvonen, «Enhanced Metal / Polymer Adhesion dy Ion Assisted Deposition, pp.373-385, 1991.

M. Morra, E. Occhiello, and F. Garbassi, Molecular Dynamic Phenomena at Polymer Surfaces and Their Relevance to Polymer Adhesion Behavior, pp.363-372, 1991.
DOI : 10.1007/978-1-4899-0735-6_29

A. Ragge and H. Meyer, Gonzalo Unutio Desmaison, «Solution d'enduction de non-conducteurs avec des polymères conducteurs et leurs procédés de métallisation », brevet, Atotech Deutschland GMBH, 1992.

G. Allardyce, K. Bass, and J. Graves, James Shelnut, «Procédé et méthode d'électrodéposition », brevet nO EP 0 731 192 Al, 1996.

. Ph, J. D. Desprez, M. Yang, A. C. Matlosz, and . West, Estimation of Front Velocity in Electrodeposition ante Highly Resistive Substrates, Electrochem. Soc, issue.1, 1997.

]. S. Gottesfeld, F. A. Uribe, and S. P. Armes, The Application of a Polypyrrole Precoat for the Metallization of Printed Circuit Boards, Journal of The Electrochemical Society, vol.139, issue.1, pp.14-15, 1992.
DOI : 10.1149/1.2069210

S. Valerio and . Gottesfeld, Application of Conductive Polymer Precoats for the Metallization ofInsulators, Synthetic Metals, issue.1, pp.55-573760, 1993.

D. Weng and U. Landau, Direct Electroplating on Nonconductors, Journal of The Electrochemical Society, vol.142, issue.8, pp.2598-2604, 1995.
DOI : 10.1149/1.2050060

. Klaassen, Electroplating of Conductive Polymers for the Metallization of Insulators, Synthetic Metals, vol.66, pp.263-273, 1994.

M. Matlosz, P. Vallotton, A. C. West, and D. Landolt, Nonuniform Current Distribution and Thickness during Electrodeposition onto Resistive Substrates, Journal of The Electrochemical Society, vol.139, issue.3, pp.752-761, 1992.
DOI : 10.1149/1.2069297

]. Yang, An Experimental and Numerical Investigation of Mass Transfer In Electrochemical Systems, 1997.

M. Matlosz, Boundary Element Calculations in Design, Electrochem. Society Proceedings Volume, PV 95-11, 1995.

W. H. Smyrl and J. Newman, Current Distribution at Electrode Edges at High CUlTent Densities, Electrochem. Soc, vol.1, issue.136, pp.132-139, 1989.

A. C. West, M. Matlosz, and D. Landolt, Normalized and Average Current Distributions on Unevenly Spaced Patterns, Journal of The Electrochemical Society, vol.138, issue.3, pp.728-735, 1991.
DOI : 10.1149/1.2085666

C. Wagner, Theoretical Analysis of the Current Density Distribution in Electrolytic Cells, Journal of The Electrochemical Society, vol.98, issue.3, pp.116-128, 1951.
DOI : 10.1149/1.2778113