W. Qu, M. Plottner, and W. J. Fischer, Microfabrication of thermoelectric generators on flexible foil substrates as a power source for autonomous microsystems, Journal of Micromechanics and Microengineering, vol.11, issue.2, p.146, 2001.
DOI : 10.1088/0960-1317/11/2/310

J. F. Marucco and . Sciences, Chimie des solides, Bonchamps-les-Laval, 2004.

A. F. Ioffe, Semiconductors Thermoelements and Thermoelctrics Colling, 1957.

G. S. Nolas, J. Sharp, and H. J. Goldsmid, Thermoelectrics : Basic principles and new materials development, 2001.
DOI : 10.1007/978-3-662-04569-5

J. R. Drabble and C. Goodmann, Chemical bonding in bismuth telluride, Journal of Physics and Chemistry of Solids, vol.5, issue.1-2, p.142, 1958.
DOI : 10.1016/0022-3697(58)90139-2

H. J. Goldsmid, Thermoelectric Refrigeration, 1964.
DOI : 10.1007/978-1-4899-5723-8

J. Harman, Preparation and some physical properties of Bi2Te3, Sb2Te3, and As2Te3, Journal of Physics and Chemistry of Solids, vol.2, issue.3, p.181, 1957.
DOI : 10.1016/0022-3697(57)90081-1

U. A. Kutasow and I. A. Smirnov, Der Einflu?? von ??bersch??ssigem antistrukturellem Bi auf die W??rmeleitf??higkeit des Kristallgitters von Bi2Te3, Bi2Te3-Sb2Te3 und Bi2Te3-Bi2S3 mit Jodbeimischung, physica status solidi (b), vol.3, issue.1, p.479, 1966.
DOI : 10.1080/00207215708937085

J. R. Wiese and L. Muldawer, Lattice constants of Bi2Te3-Bi2Se3 solid solution alloys, Journal of Physics and Chemistry of Solids, vol.15, issue.1-2, p.13, 1960.
DOI : 10.1016/0022-3697(60)90094-9

P. Villars, A. Prince, and H. Okamoto, Handbook of ternary alloy phase diagrams, Materials Park, OH ASM International, 1995.

W. M. Yim and F. D. Rosi, Compound tellurides and their alloys for peltier cooling???A review, Solid-State Electronics, vol.15, issue.10, p.1121, 1972.
DOI : 10.1016/0038-1101(72)90172-4

M. C. Custódio and A. C. Hernandes, Tellurium-rich phase in n-type bismuth telluride crystals grown by the Bridgman technique, Journal of Crystal Growth, vol.205, issue.4, p.523, 1999.
DOI : 10.1016/S0022-0248(99)00264-X

R. A. Laudise, W. A. Sunder, R. L. Barns, R. J. Cava, and T. Y. Kometani, Czochralski growth of doped single crystals of Bi2Te3, Journal of Crystal Growth, vol.94, issue.1, p.53, 1989.
DOI : 10.1016/0022-0248(89)90602-7

J. Jiang, L. Chen, S. Bai, Q. Yao, and Q. Wang, Thermoelectric properties of p-type (Bi2Te3)x(Sb2Te3)1???x crystals prepared via zone melting, Journal of Crystal Growth, vol.277, issue.1-4, p.258, 2005.
DOI : 10.1016/j.jcrysgro.2004.12.144

E. Koukharenko, N. Fréty, G. Nabias, V. G. Shepelevich, and J. C. Tedenac, Microstructural study of Bi2Te3 material obtained by ultrarapid quenching process route, Journal of Crystal Growth, vol.209, issue.4, p.773, 2000.
DOI : 10.1016/S0022-0248(99)00725-3

F. Volklein, V. Baier, U. Dillner, and E. Kesslem, Transport properties of flash-evaporated (Bi1 ??? xSbx)2Te3 films I: Optimization of film properties, Thin Solid Films, vol.187, issue.2, p.253, 1990.
DOI : 10.1016/0040-6090(90)90047-H

J. Dheepa, R. Sathyamoorthy, and S. Velumani, Characterization of Bismuth Telluride thin films ??? Flash evaporation method, Materials Characterization, vol.58, issue.8-9, p.782, 2007.
DOI : 10.1016/j.matchar.2006.11.027

J. H. Kiely and D. H. Lee, Characteristics of thin-film thermoelectric devices for power generation, Measurement Science and Technology, vol.8, issue.6, p.661, 1997.
DOI : 10.1088/0957-0233/8/6/013

A. Boulouz, A. Giani, F. Pascal-delannoy, M. Boulouz, A. Foucaran et al., Preparation and characterization of MOCVD bismuth telluride thin films, Journal of Crystal Growth, vol.194, issue.3-4, p.336, 1998.
DOI : 10.1016/S0022-0248(98)00690-3

E. Charles, E. Groubert, and A. Boyer, Structural and electrical properties of bismuth telluride films grown by the molecular beam technique, Journal of Materials Science Letters, vol.4, issue.6, p.575, 1988.
DOI : 10.1007/BF01730298

A. Dauscher, A. Thomy, and H. Scherrer, Pulsed laser deposition of Bi2Te3 thin films, Thin Solid Films, vol.280, issue.1-2, p.61, 1996.
DOI : 10.1016/0040-6090(95)08221-2

A. J. Panson, Electrolytic Preparation of Tellurides, Inorganic Chemistry, vol.3, issue.7, p.940, 1964.
DOI : 10.1021/ic50017a002

M. Takahashi, Y. Katou, K. Nagata, and S. Furuta, The composition and conductivity of electrodeposited Bi???Te alloy films, Thin Solid Films, vol.240, issue.1-2, p.70, 1994.
DOI : 10.1016/0040-6090(94)90696-3

P. Magri, C. Boulanger, and J. M. Lecuire, Synthesis, properties and performances of electrodeposited bismuth telluride films, Journal of Materials Chemistry, vol.6, issue.5, p.773, 1996.
DOI : 10.1039/jm9960600773

Y. Miyazaki and T. Kajitant, Preparation of Bi2Te3 films by electrodeposition, Journal of Crystal Growth, vol.229, issue.1-4, p.542, 2001.
DOI : 10.1016/S0022-0248(01)01225-8

B. Y. Yoo, C. K. Huang, J. R. Lim, J. Herman, M. A. Ryan et al., Electrochemically deposited thermoelectric n-type Bi2Te3 thin films, Electrochimica Acta, vol.50, issue.22, p.4371, 2005.
DOI : 10.1016/j.electacta.2005.02.016

P. Heo, K. Hagiwara, R. Ichino, and M. Okido, Electrodeposition and Thermoelectric Characterization of Bi[sub 2]Te[sub 3], Journal of The Electrochemical Society, vol.15, issue.4, p.213, 2006.
DOI : 10.1016/0022-3697(89)90045-0

W. L. Wang, C. C. Wan, and Y. Y. Wang, Composition-dependent characterization and optimal control of electrodeposited Bi2Te3 films for thermoelectric application, Electrochimica Acta, vol.52, issue.23, p.6502, 2007.
DOI : 10.1016/j.electacta.2007.04.037

L. Trahey, C. R. Becker, and A. M. Stacy, Electrodeposited Bismuth Telluride Nanowire Arrays with Uniform Growth Fronts, Nano Letters, vol.7, issue.8, p.2535, 2007.
DOI : 10.1021/nl070711w

K. Tittes and W. Plieth, Electrochemical deposition of ternary and binary systems from an alkaline electrolyte???a demanding way for manufacturing p-doped bismuth and antimony tellurides for the use in thermoelectric elements, Journal of Solid State Electrochemistry, vol.242, issue.15, p.155, 2007.
DOI : 10.1557/PROC-545-493

Q. Huang, W. Wang, and F. Jia, Preparation of Bi2-xSbxTe3 thermoelectric films by electrodeposition, Journal of University of Science and Technology Beijing, Mineral, Metallurgy, Material, vol.13, issue.3, p.277, 2006.
DOI : 10.1016/S1005-8850(06)60058-3

B. Nguyen, Electrodéposition par courants pulsés, Techniques de l'ingénieur M1627

M. Viswanathan and C. J. Raub, Pulse plating of nickel-gold alloys, Surface Technology, vol.4, issue.4, p.339, 1976.
DOI : 10.1016/0376-4583(76)90004-2

M. Chrenková-pau?írová, P. Fellner, A. Silný, and K. Matia?ovský, Electrolytic aluminium plating in molten salt mixtures based on AlCl3 II: Influences of the application of the pulsed current and of a copper underlayer, Surface Technology, vol.16, issue.1, p.15, 1982.
DOI : 10.1016/0376-4583(82)90090-5

W. D. Bancroft, The chemistry of electroplating, Journal of the Franklin Institute, vol.160, issue.2, p.139, 1905.
DOI : 10.1016/S0016-0032(05)90057-4

Y. Liu and M. Pritzker, Effect of pulse plating on composition of Sn???Pb coatings deposited in fluoroborate solutions, Journal of Applied Electrochemistry, vol.33, issue.12, p.1143, 2003.
DOI : 10.1023/B:JACH.0000003850.61488.83

D. J. Kim, Y. M. Roh, and M. H. Seo, Effects of the peak current density and duty cycle on material properties of pulse-plated Ni???P???Fe electrodeposits, Surface and Coatings Technology, vol.192, issue.1, p.88, 2005.
DOI : 10.1016/j.surfcoat.2004.03.055

L. Chen, L. Wang, Z. Zeng, and T. Xu, Influence of pulse frequency on the microstructure and wear resistance of electrodeposited Ni???Al2O3 composite coatings, Surface and Coatings Technology, vol.201, issue.3-4, p.599, 2006.
DOI : 10.1016/j.surfcoat.2005.12.008

B. Tury, M. Lakatos-varsányi, and S. Roy, Effect of pulse parameters on the passive layer formation on pulse plated Ni???Co alloys, Applied Surface Science, vol.253, issue.6, p.3103, 2007.
DOI : 10.1016/j.apsusc.2006.06.063

K. C. Yung, K. C. Chan, T. M. Yue, and K. F. Yeung, The effect of waveform for pulse plating on copper plating distribution of microvia in PCB manufacture, The International Journal of Advanced Manufacturing Technology, vol.23, issue.3-4, p.245, 2004.
DOI : 10.1007/s00170-003-1667-1

K. H. Kim, J. D. Lee, B. Y. Ahn, H. S. Kim, and Y. W. Shin, Growth of ??-Fe films on n-Si(111) substrate by pulsed electrodeposition in a non-aqueous solution, Thin Solid Films, vol.483, issue.1-2, p.74, 2005.
DOI : 10.1016/j.tsf.2004.12.031

A. Gomes, M. I. Da, and S. Pereira, Pulsed electrodeposition of Zn in the presence of surfactants, Electrochimica Acta, vol.51, issue.7, p.1342, 2006.
DOI : 10.1016/j.electacta.2005.06.023

D. Vasilakopoulos, M. Bouroushian, and N. Spyrellis, Texture and morphology of pulse plated zinc electrodeposits, Journal of Materials Science, vol.341, issue.10, p.2869, 2006.
DOI : 10.1016/S0921-5093(02)00198-3

Y. Xuetao, W. Yu, S. Dongbai, and Y. Hongying, Influence of pulse parameters on the microstructure and microhardness of nickel electrodeposits, Surface and Coatings Technology, vol.202, issue.9, p.1895, 2008.
DOI : 10.1016/j.surfcoat.2007.08.023

R. K. Sharma, G. Singh, and A. C. Rastogi, Pulsed electrodeposition of CdTe thin films: effect of pulse parameters over structure, stoichiometry and optical absorption, Solar Energy Materials and Solar Cells, vol.82, issue.1-2, p.201, 2004.
DOI : 10.1016/j.solmat.2004.01.018

V. Saaminathan and K. R. Murali, Importance of pulse reversal effect of CdSe thin films for optoelectronic devices, Journal of Crystal Growth, vol.279, issue.3-4, p.229, 2005.
DOI : 10.1016/j.jcrysgro.2005.02.020

R. K. Sharma, A. C. Rastogi, K. Jain, and G. Singh, Microstructural investigations on CdTe thin films electrodeposited using high current pulses, Physica B: Condensed Matter, vol.366, issue.1-4, p.80, 2005.
DOI : 10.1016/j.physb.2005.05.038

K. R. Murali and D. C. Trivedi, Preparation of pulse plated GaAs films, Journal of Physics and Chemistry of Solids, vol.67, issue.7, p.1432, 2006.
DOI : 10.1016/j.jpcs.2006.01.107

M. Bouroushian, T. Kosanovic, and N. Spyrellis, A pulse plating method for the electrosynthesis of ZnSe, Journal of Applied Electrochemistry, vol.63, issue.362, p.821, 2006.
DOI : 10.1007/s10800-006-9141-z

K. R. Murali and M. Balasubramanian, Properties of pulse plated ZnSe films, Materials Science and Engineering: A, vol.431, issue.1-2, p.118, 2006.
DOI : 10.1016/j.msea.2006.05.123

N. R. De-tacconi, C. R. Chenthamarakshan, K. Rajeshwar, T. Pauporté, and D. Lincot, Pulsed electrodeposition of WO?TiO composite films, Electrochemistry Communications, vol.5, issue.3, p.220, 2003.
DOI : 10.1016/S1388-2481(03)00021-3

D. Thiemig, R. Lange, and A. Bund, Influence of pulse plating parameters on the electrocodeposition of matrix metal nanocomposites, Electrochimica Acta, vol.52, issue.25, p.7362, 2007.
DOI : 10.1016/j.electacta.2007.06.009

P. Gyftou, E. A. Pavlatou, and N. Spyrellis, Effect of pulse electrodeposition parameters on the properties of Ni/nano-SiC composites, Applied Surface Science, vol.254, issue.18, p.5910, 2008.
DOI : 10.1016/j.apsusc.2008.03.151

C. A. Huang, W. Lin, and M. J. Liao, The electrochemical behaviour of the bright chromium deposits plated with direct- and pulse-current in 1M H2SO4, Corrosion Science, vol.48, issue.2, p.460, 2006.
DOI : 10.1016/j.corsci.2004.12.002

J. H. Chang, F. Y. Hsu, M. J. Liao, and C. A. Huang, A study of direct- and pulse-current chromium electroplating on rotating cylinder electrode (RCE), Applied Surface Science, vol.253, issue.16, p.6829, 2007.
DOI : 10.1016/j.apsusc.2007.01.124

N. J. Gerein and J. A. Haber, Effect of ac Electrodeposition Conditions on the Growth of High Aspect Ratio Copper Nanowires in Porous Aluminum Oxide Templates, The Journal of Physical Chemistry B, vol.109, issue.37, p.17372, 2005.
DOI : 10.1021/jp051320d

E. Pellicer, E. Gómez, and E. Vallés, Use of the reverse pulse plating method to improve the properties of cobalt???molybdenum electrodeposits, Surface and Coatings Technology, vol.201, issue.6, p.2351, 2006.
DOI : 10.1016/j.surfcoat.2006.04.011

M. P. Panicker, M. Knaster, and F. A. Kroger, Cathodic Deposition of CdTe from Aqueous Electrolytes, Journal of The Electrochemical Society, vol.125, issue.4, p.566, 1978.
DOI : 10.1149/1.2131499

J. Llabres, In Situ Preparation of Undoped p-Type CdTe by Cathodic Electrochemical Deposition, Journal of The Electrochemical Society, vol.131, issue.2, p.464, 1984.
DOI : 10.1149/1.2115609

K. Takeuchi, M. Ichimura, E. Arai, and Y. Yamazaki, SnS thin films fabricated by pulsed and normal electrochemical deposition, Solar Energy Materials and Solar Cells, vol.75, issue.3-4, p.427, 2003.
DOI : 10.1016/S0927-0248(02)00192-7

C. G. Morris and R. J. Vanderveen, Solar cells from thin films prepared by periodic pulse electrodeposition, Applied Surface Science, vol.92, p.630, 1996.
DOI : 10.1016/0169-4332(95)00307-X

W. Glatz, L. Durrer, E. Schwyter, and C. Hierold, Novel mixed method for the electrochemical deposition of thick layers of Bi2+xTe3???x with controlled stoichiometry, Electrochimica Acta, vol.54, issue.2, p.755, 2008.
DOI : 10.1016/j.electacta.2008.06.065

. Pourbaix, M, Atlas d'équilibres électrochimiques à 25°C

S. Michel, S. Diliberto, C. Boulanger, N. Stein, and J. M. Lecuire, Galvanostatic and potentiostatic deposition of bismuth telluride films from nitric acid solution: effect of chemical and electrochemical parameters, Journal of Crystal Growth, vol.277, issue.1-4, p.274, 2005.
DOI : 10.1016/j.jcrysgro.2004.12.164

G. Sauerbrey, Verwendung von Schwingquarzen zur W???gung d???nner Schichten und zur Mikrow???gung, Zeitschrift f???r Physik, vol.155, issue.2, p.206, 1959.
DOI : 10.1007/BF01337937

C. A. Goss, D. H. Charych, and M. Majda, Application of (3-mercaptopropyl)trimethoxysilane as a molecular adhesive in the fabrication of vapor-deposited gold electrodes on glass substrates, Analytical Chemistry, vol.63, issue.1, p.85, 1991.
DOI : 10.1021/ac00001a018

D. Ruer, R. Baro, and J. , R??alisation de canevas st??r??ographiques pour l'interpr??tation de figures de p??les, Journal of Applied Crystallography, vol.4, issue.4, p.321, 1971.
DOI : 10.1107/S0021889871007064

A. Vadon, D. Ruer, and R. , Automatic Drawing of Stereographic Nets, Texture, vol.1, issue.3, p.195, 1974.
DOI : 10.1155/TSM.1.195

L. G. Schulz, A Direct Method of Determining Preferred Orientation of a Flat Reflection Sample Using a Geiger Counter X???Ray Spectrometer, Journal of Applied Physics, vol.19, issue.11, p.1030, 1949.
DOI : 10.1063/1.1715039

M. Field, Reflection Method of Determining Preferred Orientation on the Geiger???Counter Spectrometer, Journal of Applied Physics, vol.43, issue.8, p.741, 1949.
DOI : 10.1063/1.1715077

F. C. Frank, The influence of dislocations on crystal growth, Discussions of the Faraday Society, vol.5, p.48, 1949.
DOI : 10.1039/df9490500048

A. Bewick, H. R. Fleischmann, and . Thirsk, Kinetics of the electrocrystallization of thin films of calomel, Transactions of the Faraday Society, vol.58, p.2200, 1962.
DOI : 10.1039/tf9625802200

M. Petri and D. M. Kolb, Nanostructuring of a sodium dodecyl sulfate-covered Au(111) electrode, Physical Chemistry Chemical Physics, vol.4, issue.7, p.1211, 2002.
DOI : 10.1039/b110142k

M. Paunovic and M. Schlesinger, Fundamentals of electrochemical deposition, 1998.
DOI : 10.1002/0470009403

D. C. Grahame, The Electrical Double Layer and the Theory of Electrocapillarity., Chemical Reviews, vol.41, issue.3, p.441, 1947.
DOI : 10.1021/cr60130a002

J. C. Puippe and F. Leaman, Theory and practice of pulse plating, 1986.

B. Tury, M. Lakatos-varsányi, and S. Roy, Ni???Co alloys plated by pulse currents, Surface and Coatings Technology, vol.200, issue.24, p.6713, 2006.
DOI : 10.1016/j.surfcoat.2005.10.008

W. J. Li and K. L. Hsueh, Study of electrodeposition of bismuth telluride by voltammetric methods and in-situ electrochemical quartz crystal microbalance method, Thin Solid Films, vol.515, issue.20-21, p.7847, 2007.
DOI : 10.1016/j.tsf.2007.04.037

H. Zou, D. M. Rowe, and S. G. Williams, Peltier effect in a co-evaporated Sb2Te3(P)-Bi2Te3(N) thin film thermocouple, Thin Solid Films, vol.408, issue.1-2, p.270, 2002.
DOI : 10.1016/S0040-6090(02)00077-9