J. Venables, Adhesion and durability of metal-polymer bonds, J Mater Sci, vol.19, pp.2431-2453, 1984.

I. Mathieson and R. Bradley, Improved adhesion to polymers by UV/ozone surface oxidation, Int J Adhes Adhes, vol.16, pp.29-31, 1996.

R. S. Rivlin, The effective work of adhesion, pp.215-216, 1944.

J. G. Spies, The peeling test on redux-bonded joints, J. Aircraft Engng, vol.25, p.64, 1953.

K. Kendall, Thin film peeling : the elastic term, J. Phys D Appl Phys, vol.8, pp.1449-1452, 1975.

K. Kim and N. Aravas, Elastoplastic analysis of the peel test, Int. J. Solids Struct, vol.24, pp.417-435, 1988.

Y. Wei and J. W. Hutchinson, Interface strength, work of adhesion and plasticity in the peel test, Int. J. Fracture, vol.93, pp.315-333, 1998.

N. Aravas, K. Kim, and M. Loukis, On the mechanics of adhesion testing of flexible films, Materials Science and Engineering, vol.107, pp.159-168, 1989.

P. Martiny, F. Lani, A. J. Kinloch, and T. Pardoen, Numerical analysis of the energy contributions in peel tests: a steady-state multilevel finite element approach, Int. J. Adhes, vol.28, pp.222-236, 2008.

J. A. Williams and J. J. Kauzlarich, The influence of peel angle on the mechanics of peeling flexible adherends with arbitrary load-extension characteristics, Tribology International, vol.38, pp.951-958, 2005.

A. Molinari and G. Ravichandran, Peeling of elastic tapes: effects of large deformations, prestrainning and of a peel-zone model, J Adhes, vol.84, pp.961-995, 2008.

W. Sabbah, O. Avino-salvado, C. Buttay, H. Frémont, A. Guédon-gracia et al., High temperature ageing of microelectronics assemblies with SAC solder joints, Microelectronics Reliability, Vols, pp.362-367, 2017.
URL : https://hal.archives-ouvertes.fr/hal-01564755

C. F. Coombs, Printed Circuits Handbook, 2001.

A. Salaouelhadj, M. Martiny, S. Mecier, L. Bodin, D. Manteigas et al., Reliability of thermally stressed rigid-flex printed circuit boards for High Density Interconnect applications, Microelectronics Reliability, vol.54, pp.204-213, 2014.

M. Freda and P. Reid, IPC Printed Circuit Expo, APEX and Designer summit procedings, 2009.

C. Kovalchick, A. Molinari, and G. Ravichandran, An experimental investigation of the stability of peeling for adhesives tapes, J. of Mechs of Materials, vol.66, pp.69-78, 2013.

J. J. Benbow and F. C. Roesler, Experiments on controlled fractures, Proc. Phys. Soc, vol.70, pp.201-211, 1957.

J. W. Obreimoff, The splitting Strength of Mica, Trans. Inst. Econ. Mineral, Metall, pp.290-297, 1930.

K. S. Kim and J. Kim, Elastoplastic analysis of peel test for thin film adhesion, J. Engin. Mat. Tech, vol.110, pp.266-273, 1988.

Z. Peng, C. Wang, L. Chen, and S. Chen, Peeling behavior of a viscoelastic thin film on a rigid substrate, Int. J of Solids and structures, vol.51, pp.4596-4603, 2014.

C. Kovalchick, S. Xia, and G. Ravichandran, Cohesive zone law extraction from an experimental peel test, Experimental And Applied Mechanics, vol.4, pp.237-245, 2013.

H. Zhao and Y. Wei, Determination of interface properties between micron-thick metal film and ceramic substrate using peel test, Int. J. of Fracture, vol.144, pp.103-112, 2007.

C. Kovalchick, Mechanics of peeling: Cohesive zone law and Stability, Thesis, 2011.

L. Afferrante and G. Carbone, The ulthratough peeling of elastic tapes from viscoelastic substrates, J of the Mechanics and Phys of Solids, vol.96, pp.223-234, 2016.

Y. Wei and H. Zhao, Peeling experiments of ductile thin films along ceramic substrates-critical assessment of analytical models, Int. J.of solids and strucutres, vol.45, pp.3779-3792, 2008.

L. F. Kawashita, D. R. Moore, and J. G. Williams, Analysis of peel arm curvature for the determination of fracture toughness in metal-polymer laminates, J. of Materials Science, pp.241-248, 2005.

G. Covarel, B. Bensaid, X. Boddaert, S. Giljean, P. Benaben et al., Characterization of organic ultra-thin film adhesion on flexible substrate using scratch test technique, Surface & Coatings Technology, vol.211, pp.138-142, 2012.
URL : https://hal.archives-ouvertes.fr/emse-00768609

X. Boddaert, G. Covarel, B. Bensaid, M. Mattei, P. Benaben et al., Organic ultrathin film adhesion on compliant substrate using scratch test technique, Thin Solid Films, vol.528, pp.194-198, 2013.
URL : https://hal.archives-ouvertes.fr/emse-00768611

J. Song and J. Yu, Analysis of T-peel strength in a Cu/Cr/Polyimide system, Acta Materialia, vol.50, pp.3985-3994, 2002.

J. A. Williams and J. J. Kauzlarich, Peeling shear and cleavage failure due to tape prestrain, J Adhes Technol, vol.80, pp.433-458, 2004.

M. J. Loukis and N. Aravas, The effects of viscoelasticity in the peeling of polymeric films, J. Adhes, vol.35, pp.7-22, 1991.

H. Chen, X. Feng, Y. Huang, Y. Huang, and A. Rogers, Experiments and viscoelastic analysis of peel test with patterned strips for applications to transfer printing, J. Mech. Phys solids, vol.61, pp.1737-1752, 2003.

D. H. Kaelble, Theory and analysis of peel adhesion: rate-temperature dependence of viscoelastic interlayers, J. Colloid Sci, vol.19, pp.413-424, 1964.

E. H. Andrews and A. J. Kinloch, Mechanics of adhesive failure, Pro R. Soc Lond A, vol.332, pp.401-414, 1973.

W. T. Chen and T. F. Flavin, Mechanics of film adhesion: elastic and elastic-plastic behavior, J. Res. Dev, vol.16, pp.203-213, 1972.

A. Gent and G. R. Hamed, Peel mechanics for an elastic-plastic adherend, J. Appl. Polym. Sci, vol.21, pp.2809-2817, 1977.

A. D. Crocombe and R. D. Adams, Peel analysis using the finite element method, J. Adhes, vol.12, pp.120-127, 1981.

M. D. Chang, K. L. Devries, and M. L. Williams, The effects of plasticity in adhesive fracture, J. Adhes, vol.4, pp.215-221, 1972.

J. Kim, K. S. Kim, and Y. H. Kim, Mechanical effects of peel adhesion test, J. Adhes Sci. Tech, vol.3, pp.175-187, 1989.

Y. Wei, Modeling non linear peeling of ductile thin films -critical assessment of analytical bending models using FE simulations, Int. J. of solids and Structures, vol.41, pp.5087-5104, 2004.

A. J. Kinloch, C. C. Lau, and J. G. Williams, The peeling of flexible laminates, Int. J. Fracture, vol.66, pp.45-70, 1994.

N. Moës, C. Stolz, P. Bernard, and N. Chevaugeon, A level set based model for damage growth: the thick level set approach, Int. J. Numer. Meth. Eng, vol.86, issue.3, pp.358-380, 2011.

T. Gorris, P. E. Bernard, and L. Stainier, A study of transverse cracking in laminates by the Thick Level Set approach, Mechanics of Materials, vol.90, pp.118-130, 2015.
URL : https://hal.archives-ouvertes.fr/hal-01150856

D. S. Dugdale, Yielding of steel sheets containing slits, J. Mech. Phys. Solids, vol.8, pp.100-104, 1960.

G. I. Barenblatt, The Mathematical Theory of Equilibrium Cracks in Brittle Fracture, Adv. Appl. Mechs, vol.7, pp.55-129, 1962.

V. Tvergaard and J. W. Hutchinson, The relation between crack growth resistance and fracture process parametres in elastic-plastic solids, J. Mech. Phys. Solids, vol.40, issue.6, pp.1377-1397, 1992.

A. Needleman, A Continuum Model for void Nucleation by inclusion debonding, J. of Applied Mechanics, vol.54, pp.525-531, 1987.

A. Needleman, An Analysis of tensile decohesion along an interface, J. Mechs. Phys. Solids, vol.38, issue.3, pp.289-324, 1990.

V. Tvergaard and J. W. Hutchinson, The influence of plasticity on mixed mode interface toughness, J. Mech. Phys. Solids, vol.41, issue.6, pp.1119-1135, 1993.

J. Cui, R. Wang, A. N. Sinclair, and J. K. Spelt, A calibrated finite element model of adhesive peeling, Int. J. Adhes, vol.23, pp.199-206, 2003.

, Institute for Interconnecting and Packaging Electronic Circuits, IPC, 1994.

G. Girard, Caractérisation et modélisation thermomécaniques de matériaux et de structures, 2018.

G. Girard, M. Jrad, S. Bahi, M. Martiny, S. Mercier et al., Experimental and numerical characterization of thin woven composites used in printed circuit boards for high frequency application, Composite Structure, vol.193, pp.140-153, 2018.

E. Simlissi, M. Martiny, M. Mercier, M. S. Bahi, and L. Bodin, Elastic-plastic analysis of the peel test for ductile thin film presenting a saturation of the yield stress, Int Journal of Fracture, vol.220, pp.1-16, 2019.
URL : https://hal.archives-ouvertes.fr/hal-02342107

E. Voce, The relationship between stress and strain for homogeneous deformations, J Inst Metals, issue.74, pp.537-562, 1984.

Y. Wei, Modeling non linear peeling of ductile thin films -critical assessment of analytical bending models using FE simulations, International Journal of Solids and Structures, vol.41, pp.5087-5104, 2004.

K. Kendall, Shrinkage and peel strength of adhesive joints, J. Phys, D Appl Phys, vol.6, pp.1782-1787, 1973.

S. A. Moidu and K. , On the determination of fracture energy using the peel test, Journal of Testing and Evaluation, vol.26, pp.247-254, 1998.

P. P. Camanho and C. G. Dàvila, Mixed-Mode Decohesion Finite Elements for the Simulation of Delamination in Composite Materials, NASA/TM-2002-211737, pp.1-37, 2002.

R. Hill, The mathematical theory of plasticity, 1950.

M. D. Thouless and Q. D. Yang, A parametric study of the peel test, Int Journal of Adhesion and Adhesives, vol.28, pp.176-184, 2008.

I. K. Mohammed, M. N. Charalambides, and A. J. Kinloch, Modelling the interfacial peeling of pressure-sensitive adhesives, Journal of non-Newtonian fluid Mechanics, vol.222, pp.141-150, 2015.

S. Tantideeravit, M. N. Charalambides, D. S. Balint, and C. R. Young, Prediction of delamination in multilayer artist paints under low amplitude fatigue loading, Engineering Fracture Mechanics, pp.41-57, 2013.

B. R. Blackman, H. Hadavinia, A. J. Kinloch, and J. G. Williams, The use of a cohesive zone model to study the fracture of fibre composites and adhesively-bonded joints, Int. Journal of fracture, vol.119, pp.25-46, 2003.

L. Caillé, J. L. Hanus, F. Delvare, and N. Michaux-leblond, MFS fading regularization method for the identification of boundary conditions from partial elastic displacement field data, European Journal of Computational Mechanics, vol.27, pp.508-539, 2018.

J. Jung, M. Cho, and M. Zhou, Ab initio study of the fracture energy of LiFePO4/FePO4 interfaces, Journal of Power Sources, vol.243, pp.706-714, 2013.

A. Hallil, J. M. Raulot, and M. Cherkaoui, Atomistic simulations of Cu2O bulk and Cu/Cu2O interface properties by using a new interatomic potential, Computational Materials Science, vol.81, pp.366-373, 2014.

. Enfin, des simulations de pelage par éléments finis sont effectuées pour différents angles

, Le substrat est supposé élastique orthotrope. L'interface est modélisée par des éléments cohésifs en utilisant une loi de type traction séparation bilinéaire. Les résultats des simulations (EF) sont comparés aux données expérimentales de la thèse

, Au final, ce travail de thèse permet de proposer un dialogue essai / simulations numériques pour définir précisément l

, Mots clés : test de pelage, énergie d'interface, film mince, éléments cohésifs, modélisation