Journal Articles
Composites Science and Technology
Year : 2021
Guo-Hua HU : Connect in order to contact the contributor
https://hal.univ-lorraine.fr/hal-03504121
Submitted on : Tuesday, December 28, 2021-5:59:43 PM
Last modification on : Wednesday, March 27, 2024-4:11:33 PM
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- HAL Id : hal-03504121 , version 1
- DOI : 10.1016/j.compscitech.2021.108760
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Yang Hu, Chao Chen, Yingfeng Wen, Zhigang Xue, Xingping Zhou, et al.. Novel micro-nano epoxy composites for electronic packaging application: Balance of thermal conductivity and processability. Composites Science and Technology, 2021, 209, pp.108760. ⟨10.1016/j.compscitech.2021.108760⟩. ⟨hal-03504121⟩
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