Novel micro-nano epoxy composites for electronic packaging application: Balance of thermal conductivity and processability - Université de Lorraine
Journal Articles Composites Science and Technology Year : 2021

Novel micro-nano epoxy composites for electronic packaging application: Balance of thermal conductivity and processability

Yang Hu
Chao Chen
Yingfeng Wen
  • Function : Author
Zhigang Xue
  • Function : Author
Xingping Zhou
  • Function : Author
Dean Shi
Guo-Hua Hu
Université de Lorraine
Xiaolin Xie
  • Function : Author

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Chemical and Process Engineering

Guo-Hua HU  : Connect in order to contact the contributor

https://hal.univ-lorraine.fr/hal-03504121

Submitted on : Tuesday, December 28, 2021-5:59:43 PM

Last modification on : Wednesday, March 27, 2024-4:11:33 PM

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hal-03504121 , version 1 (28-12-2021)

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Yang Hu, Chao Chen, Yingfeng Wen, Zhigang Xue, Xingping Zhou, et al.. Novel micro-nano epoxy composites for electronic packaging application: Balance of thermal conductivity and processability. Composites Science and Technology, 2021, 209, pp.108760. ⟨10.1016/j.compscitech.2021.108760⟩. ⟨hal-03504121⟩

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