Novel micro-nano epoxy composites for electronic packaging application: Balance of thermal conductivity and processability - Université de Lorraine Access content directly
Journal Articles Composites Science and Technology Year : 2021

Novel micro-nano epoxy composites for electronic packaging application: Balance of thermal conductivity and processability

Yang Hu
Chao Chen
  • Function : Author
Yingfeng Wen
  • Function : Author
Zhigang Xue
  • Function : Author
Xingping Zhou
  • Function : Author
Dean Shi
Guo-Hua Hu
Xiaolin Xie
  • Function : Author
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hal-03504121 , version 1 (28-12-2021)

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Yang Hu, Chao Chen, Yingfeng Wen, Zhigang Xue, Xingping Zhou, et al.. Novel micro-nano epoxy composites for electronic packaging application: Balance of thermal conductivity and processability. Composites Science and Technology, 2021, 209, pp.108760. ⟨10.1016/j.compscitech.2021.108760⟩. ⟨hal-03504121⟩

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