Modélisation par éléments finis et prédiction de vie d'assemblages électroniques

Abstract : This internship thesis is about finite element modeling and prediction life of electronic assemblies in vibratory environment. This paper outlines the general approach of finite element modeling (modal analysis, random vibrations analysis and harmonic responses) for electronic assemblies via the ANSYS® code. An implementation of this approach is given for electronic cards and for an electronic box (equipment containing two electronic cards). In the case of the cards, the aim is, from simple finite element models to establish a law of life prediction for cards components. In the case of the electronic box, the aim is to propose a solution following the failure of components in vibration testing.
Document type :
Master thesis
File URL :
http://docnum.univ-lorraine.fr/prive/BUS_M_2013_ADDI_KARIM.pdf
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https://hal.univ-lorraine.fr/hal-01777811
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Submitted on : Wednesday, April 25, 2018 - 10:11:18 AM
Last modification on : Wednesday, April 25, 2018 - 10:11:18 AM

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  • HAL Id : hal-01777811, version 1

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Karim Addi. Modélisation par éléments finis et prédiction de vie d'assemblages électroniques. Génie des procédés. 2013. ⟨hal-01777811⟩

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