Evolution of texture and microstructure in pulsed electro-deposited Cu treated by Surface Mechanical Attrition Treatment (SMAT) - Université de Lorraine Access content directly
Journal Articles Journal of Alloys and Compounds Year : 2010

Evolution of texture and microstructure in pulsed electro-deposited Cu treated by Surface Mechanical Attrition Treatment (SMAT)

Abstract

This paper presents the microstructure and texture evolution in pulsed electro-deposited copper samples and the additional effect of the Surface Mechanical Attrition Treatment (SMAT), which were analyzed by means of electron backscattering and X-ray diffractions. A transition in the microstructure was observed as the thickness of the deposit increased: from randomly oriented equiaxed (3D) nanograins at the beginning of the deposition process towards elongated (2D) nanograins having a strong 〈1 1 0〉 fibre texture. Meanwhile, the SMAT treatment is shown to randomize the strong texture of the electrodeposits.
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Dates and versions

hal-03059589 , version 1 (12-12-2020)

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Romain Blonde, Hoi-Lam Chan, Nathalie Allain-Bonasso, Bernard Bolle, Thierry Grosdidier, et al.. Evolution of texture and microstructure in pulsed electro-deposited Cu treated by Surface Mechanical Attrition Treatment (SMAT). Journal of Alloys and Compounds, 2010, 504, pp.S410-S413. ⟨10.1016/j.jallcom.2010.04.040⟩. ⟨hal-03059589⟩

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