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Three-Dimensional Thermomechanical Simulation of Fine-Pitch High-Count Ball Grid Array Flip-Chip Assemblies

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https://hal.univ-lorraine.fr/hal-03345864
Contributor : Napo BONFOH Connect in order to contact the contributor
Submitted on : Wednesday, September 15, 2021 - 8:13:49 PM
Last modification on : Friday, August 5, 2022 - 2:54:00 PM

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W. Kpobie, N. Bonfoh, C. Dreistadt, M. Fendler, P. Lipinski. Three-Dimensional Thermomechanical Simulation of Fine-Pitch High-Count Ball Grid Array Flip-Chip Assemblies. Journal of Electronic Materials, Institute of Electrical and Electronics Engineers, 2014, 43 (3), pp.671-684. ⟨10.1007/s11664-013-2669-x⟩. ⟨hal-03345864⟩

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