Three-Dimensional Thermomechanical Simulation of Fine-Pitch High-Count Ball Grid Array Flip-Chip Assemblies - Université de Lorraine Access content directly
Journal Articles Journal of Electronic Materials Year : 2014

Three-Dimensional Thermomechanical Simulation of Fine-Pitch High-Count Ball Grid Array Flip-Chip Assemblies

W. Kpobie
  • Function : Author
C. Dreistadt
  • Function : Author
M. Fendler
  • Function : Author
P. Lipinski
  • Function : Author
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hal-03345864 , version 1 (15-09-2021)

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W. Kpobie, N. Bonfoh, C. Dreistadt, M. Fendler, P. Lipinski. Three-Dimensional Thermomechanical Simulation of Fine-Pitch High-Count Ball Grid Array Flip-Chip Assemblies. Journal of Electronic Materials, 2014, 43 (3), pp.671-684. ⟨10.1007/s11664-013-2669-x⟩. ⟨hal-03345864⟩
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