Approche thermomécanique du comportement des éléments de modules réalisés dans le cadre d'une nouvelle filière de technologie électronique

Abstract : The aim of this work is the study of leadftin solder joints behaviours of electronic components on isolated metallic substrates. In a first time, the thermal diffusivity of the different layers of the substrate and. the thermal contact resistivity are measured. The experiments use the laser flash method. The temperature behind the sample is determinated with an optical detector. The calculation of real thermal parameters is based on the simplex method. In the second part, the thermomechanical behaviour modelisation needs a finite elements program. ANSYS has been used. The sample is solicited during a thermal cycle in the range of -30°C, + 120°C. Bilinear behaviour laws are necessary to describe the elasto-plastic strains and the crcep-stress relaxation phenomenon is reached by using a creep law. The Von Mises criterion is used to locate the domains of maximums stresses. As the last, during the accelereted test, the vibrational behaviour study did not revealed any failures. However, the distributions of stresses indicate possible failure: this last result cornes from a diticiency of the ANS YS program, that does not take into account the nonlinear properties of
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Theses
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http://docnum.univ-lorraine.fr/prive/INPL_T_1996_KADIRI_E_K.pdf
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https://hal.univ-lorraine.fr/tel-01752305
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Submitted on : Thursday, March 29, 2018 - 1:40:43 PM
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El Khamis Kadiri. Approche thermomécanique du comportement des éléments de modules réalisés dans le cadre d'une nouvelle filière de technologie électronique. Autre. Institut National Polytechnique de Lorraine, 1996. Français. ⟨NNT : 1996INPL029N⟩. ⟨tel-01752305⟩

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