Caractérisation, analyse et modélisation du MOSFET de puissance en carbure de silicium

Abstract : Silicon carbide (SiC) has actively been emerged as the most viable candidate of the wide band gap (WBG) semiconductors to replace silicon (Si) in the near future. Due to its inherent properties, SiC enables the development of new generation semiconductor devices that offer great performance improvements, resulting in more efficient and compact designs in various power electronics applications. The 1.2 kV SiC MOSFETs, which are by far the most important devices in the SiC family, have been quickly used as the replacement of Si IGBTs in many applications due to their superior characteristics. However, at an early stage of development, SiC MOSFETs come with their own list of technical and economic issues which have somehow limited their widespread implementation for power electronics applications. The characterization and modeling, in particular on-state of the SiC MOSFET, have been investigated in this dissertation to develop insight of the unique characteristics along with the effects on the design of power converters. In such a way, the characterization test benches for high voltage power MOSFETs have been developed. The device is characterized using appropriate methods, which allows the junction temperature to remain constant during the measurement. The characteristics are then analyzed and compared to these of Si counterpart to provide further understanding of SiC MOSFETs. Subsequently, a novel compact model has been developed for circuit simulation, taking into account physical phenomena including interface traps, short-channel, intrinsic JFET and temperature effects. As a modified version of the Shichman Hodges, the model employs a few adjustment parameters, which are mostly derived from curve fitting of experimental data, using optimization tool software. The proposed model with fairly simple current equation thus is expedient to represent the DC behavior of power MOSFET for a wide range of operation conditions. In the end, the thermal characterization of SiC MOSFETs is examined. The on-resistance has been proposed as a temperature-sensitive electrical parameter (TSEP) to estimate the junction temperature. In the presence of the interface traps, the dedicated test benches have been developed for SiC MOSFET temperature measurement based on TSEP. 3D Finite element (FEM) simulation is performed to investigate thermal distribution inside the module. By comparing with the experiments, the electro-thermal model is validated with acceptable accuracy.
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Dinh-Lam Dang. Caractérisation, analyse et modélisation du MOSFET de puissance en carbure de silicium. Energie électrique. Université de Lorraine, 2019. Français. ⟨NNT : 2019LORR0052⟩. ⟨tel-02328690⟩

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