Individual Phase Mechanical Properties at Different Temperatures of Sn-Ag-Cu Lead-Free Solders Incorporating Special Pileup Effects Using Nanoindentation - Archive ouverte HAL Access content directly
Journal Articles Journal of Electronic Packaging Year : 2015

Individual Phase Mechanical Properties at Different Temperatures of Sn-Ag-Cu Lead-Free Solders Incorporating Special Pileup Effects Using Nanoindentation

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Abstract

Sn-Ag-Cu (SAC) alloys are considered as good replacements of Sn-Pb alloys which are banned due to the toxic nature of Pb. But, SAC alloys have a coarse microstructure that consists of beta-Sn rich and eutectic phases. Nanoindentation is a useful technique to evaluate the mechanical properties at very small length scale. In this work, continuous stiffness measurement (CSM) nanoindentation setup (CSM Instruments SA, Peseux, Switzerland) is used to determine the individual phase mechanical properties like Young's modulus and hardness at high temperatures. It is demonstrated that these properties are a function of temperature for both beta-Sn rich and eutectic phases. Loadings starting from 500 mu N up to 5000 mu N are used with 500 mu N steps and average values are presented for Young's modulus and hardness. The loading rates applied are twice that of the loadings. High temperatures result in a higher creep deformation and therefore, to avoid it, different dwell times are used at peak loads. The special pileup effect, which is more significant at elevated temperatures, is determined and incorporated into the results. A better agreement is found with the previous studies.
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Dates and versions

hal-01514680 , version 1 (26-04-2017)

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Muhammad Sadiq, Jean-Sebastien Lecomte, Mohammed Cherkaoui. Individual Phase Mechanical Properties at Different Temperatures of Sn-Ag-Cu Lead-Free Solders Incorporating Special Pileup Effects Using Nanoindentation. Journal of Electronic Packaging, 2015, 137 (3), ⟨10.1115/1.4029836⟩. ⟨hal-01514680⟩
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