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Journal Articles Acta Materialia Year : 2019

Quantitative 3D mesoscopic modeling of grain interactions during equiaxed dendritic solidification in a thin sample

Antonio Olmedilla
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Miha Založnik
Hervé Combeau

Abstract

A 3D mesoscopic envelope model is used to numerically simulate the experimental X-ray observations of isothermal equiaxed dendritic solidification of a thin sample of Al-20 wt % Cu alloy. We show the evo- lution of the system composed of multiple grains growing under influence of strong solutal interactions. We emphasize the three-dimensional effects in the thin sample thickness on the growth kinetics, focusing on three aspects: (i) the impact of the third dimension on the solute diffusion, (ii) the influence of the orientation of the preferential grain growth directions <100> on the interactions with the confining sample walls, and (iii) the influence of the grain position along the sample thickness. We demonstrate the importance of considering the three-dimensional structure of the thin samples despite the small thickness. We further show that the mesoscopic envelope model can accurately describe the shape and the time-evolution of the equiaxed grains growing under influence of strong solutal interactions.
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Dates and versions

hal-02381280 , version 1 (19-01-2021)

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Attribution - NonCommercial - NoDerivatives

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Antonio Olmedilla, Miha Založnik, Hervé Combeau. Quantitative 3D mesoscopic modeling of grain interactions during equiaxed dendritic solidification in a thin sample. Acta Materialia, 2019, 173, pp.249-261. ⟨10.1016/j.actamat.2019.05.019⟩. ⟨hal-02381280⟩
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