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Quantitative 3D mesoscopic modeling of grain interactions during equiaxed dendritic solidification in a thin sample

Abstract : A 3D mesoscopic envelope model is used to numerically simulate the experimental X-ray observations of isothermal equiaxed dendritic solidification of a thin sample of Al-20 wt % Cu alloy. We show the evo- lution of the system composed of multiple grains growing under influence of strong solutal interactions. We emphasize the three-dimensional effects in the thin sample thickness on the growth kinetics, focusing on three aspects: (i) the impact of the third dimension on the solute diffusion, (ii) the influence of the orientation of the preferential grain growth directions <100> on the interactions with the confining sample walls, and (iii) the influence of the grain position along the sample thickness. We demonstrate the importance of considering the three-dimensional structure of the thin samples despite the small thickness. We further show that the mesoscopic envelope model can accurately describe the shape and the time-evolution of the equiaxed grains growing under influence of strong solutal interactions.
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https://hal.univ-lorraine.fr/hal-02381280
Contributor : Miha Založnik <>
Submitted on : Tuesday, November 26, 2019 - 3:23:29 PM
Last modification on : Friday, January 24, 2020 - 3:02:14 PM

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Antonio Olmedilla, Miha Založnik, Hervé Combeau. Quantitative 3D mesoscopic modeling of grain interactions during equiaxed dendritic solidification in a thin sample. Acta Materialia, Elsevier, 2019, 173, pp.249-261. ⟨10.1016/j.actamat.2019.05.019⟩. ⟨hal-02381280⟩

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